View Proceedings
by Topic

7th International Symposium on Advanced Gate Stack Technology

September 29 - October 1, 2010
Albany, NY

Peering into Moore's Crystal Ball: Transistor Scaling Beyond the 15nm node Kelin Kuhn, Intel
Electrical Characterization of the III-V and Oxide Interface Suman Datta, PennStateUniversity
Effects of InGaAs Surface Nitridation on InGaAs MOS Interface Properties Shinichi Takagi, University of Tokyo
Scaling FETs to 10 nm: Coulomb Effects, Source Starvation, and Virtual Source Massimo Fischetti, Univeristy of Texas at Dallas
DFT MD of Defect Passivation by Oxides on III-V and Ge Surfaces Andrew Kummel, University of California, San Diego
Quantification of Trap State Densities at High-k/III-V Interfaces Susanne Stemmer, Univ of California, Santa Barbara
III-V Gate Stacks on III-V: New Experimental Results Serge Oktyabrsky, University at Albany
III-V on Si for VLSI Richard Hill, SEMATECH
Metal Gate / High-k Reliability Characterization: From Research to Development and Manufacturing Andres Kerber, GLOBALFOUNDRIES
Understanding of Post-Breakdown Reliability of High-? Gate Dielectric Stacks Using Physical Analysis Techniques Kin Leong Pey, Singapore University of Technology and Design
Defect Depth Profiling of Gate Dielectric - Some Controversial Points Kin Wah (Charles) Cheung, NIST
III-V Gate Stack Electrical Characterization Thomas Hoffmann , IMEC
RRAM Technology From an Industrial Perspective In-Gyu Baek , Samsung
Charge Trap Memories and 3D Approaches Gabriel Molas, CEA-LETI
A Survey of Cross Point Phase Change Memory Technologies DerChang Kau, Intel Corporation
Recent Advancements in Spin-Torque Switching for High-Density MRAM John Slaughter, Everspin
STT MRAM with High Thermal Stability Bernard Diény, SPINTEC
Status and Challenges for Non-Volatile Spin-Transfer Torque RAM (STT-RAM) Mohamad Krounbi, Grandis
Progress in Metal Oxide RRAM David Gilmer, SEMATECH
Electrical and Reliability Characteristics of RRAM forCross-point Memory Applications Hyunsang Hwang, Gwangju Institute of Science and Technology (GIST), KOREA
Investigation of RRAM Devices for Radiation Harden Applications Wei Wang, University at Albany
Basics of RRAM based on transition metal oxides
Hisashi Shima, Nanodevice Innovation Research Center
Oxides / Metals for Spin Based Nanoelectronics Kang Wang, University of California, Los Angeles
Magneto-Electric Coupling at Oxide Interfaces Alex Demkov, University of Texas at Austin
Tunnel FET Gate-Stack Characterization Alan Seabaugh, University of Notre Dame